2024

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  [1]

  B. Kersten, Rohan Akolkar, and C. E. Duval, “An electrochemical technique for sensing uranium adsorption and desorption,” Analytica Chimica Acta, vol. 1284, pp. 342003–342003, Dec. 2023, doi: https://doi.org/10.1016/j.aca.2023.342003.

   

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  B. Holcombe, N. Sinclair, R. Wasalathanthri, B. Mainali, E. Guarr, A. A. Baker, S. O. Usman, E. Kim, S. Sen-Britain, H. Jin, S. K. McCall, R. Akolkar, “Sustainable and Energy-Efficient Production of Rare-Earth Metals via Chloride-Based Molten Salt Electrolysis,” ACS Sustainable Chemistry & Engineering, Feb. 2024. Download

• T. Phung, N. Sinclair, R. Akolkar, “Potential–Dependent BDAC Adsorption on Zinc Enabling Selective Suppression of Zinc Corrosion for Energy Storage Applications,” Journal of The Electrochemical Society, Feb. 2024. Download

2023

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  [1]

  B. Kersten, Rohan Akolkar, and C. E. Duval, “An electrochemical technique for sensing uranium adsorption and desorption,” Analytica Chimica Acta, vol. 1284, pp. 342003–342003, Dec. 2023, doi: https://doi.org/10.1016/j.aca.2023.342003.

   

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  V. S. Jeganathan, N. Sinclair, R. Akolkar, “Methods—Meso-Scale Electrodes for Characterizing Diffusion-Reaction Properties of Redox-Active Organics in Viscous Electrolytes,” Journal of The Electrochemical Society, Dec. 2023. Download
• B. Kersten, N. Shaheen, R. Akolkar, “Mathematical Framework Underlying the In Situ Electrochemical Diagnosis of Adsorbed Intermediates Formed during Redox Reactions at Electrode Surfaces,” Journal of The Electrochemical Society, Oct. 2023. Download
• B. Kersten, R. Akolkar, and C. E. Duval, “An electrochemical technique for sensing uranium adsorption and desorption,” Analytica Chimica Acta, vol. 1284, pp. 342003–342003, Dec. 2023. Download

• A. L. Clemens, J. T. Davis, C. A. Orme, A. Ivanovskaya, R. Akolkar, and N. A. Dudukovic, “Predictive Modeling of Electrodeposition in a Single Pore Flow-Through Electrode : From Electronucleation to Coating Thickness Uniformity Predictive Modeling of Electrodeposition in a Single Pore Flow- Through Electrode : From Electronucleation to Coating Thickness Uniformity,” Journal of The Electrochemical Society, Jan. 2023. Download

2022‌

• B. Kersten, K. Hawthorne, M. Williamson, R. Akolkar, and C. E. Duval, “Synthesis of americium trichloride via chlorination of americium oxide using zirconium tetrachloride in LiCl–KCl molten salt,” Journal of Radioanalytical and Nuclear Chemistry, Sep. 2022. Download

• R. Wasalathanthri and R. Akolkar, “Perspective—does the sand equation reliably predict the onset of morphological evolution in lithium electrodeposition?,” J. Electrochem. Soc., Aug. 2022. Download
• Y. Zhang, J. M. Klein, R. Akolkar, B. E. Gurkan, and E. J. Maginn, “Solvation Structure, Dynamics, and Charge Transfer Kinetics of Cu²⁺ and Cu⁺ in Choline Chloride Ethylene Glycol Electrolytes” The Journal of Physical Chemistry B, Aug. 2022. Download
• N. A. Shaheen, W. Dean, D. Penley, B. Kersten, J. Rintamaki, M. B. Vukmirovic, B. E. Gurkan, R. Akolkar, "Electro–Oxidation of Nitroxide Radicals: Adsorption–Mediated Charge Transfer Probed Using SERS and Potentiometry", J. Electrochem. Soc., 169 (2022) 053511 Download
• R. Akolkar, “Perspective—is sustainable electrowinning of neodymium metal achievable?”, J. Electrochem. Soc., 169 (2022) 043501. Download

2021

• R. N. Wasalathanthri, Y. Gong, M. M. Beiner, A. N. Ivanovskaya, N. A. Dudukovic, and R. Akolkar, "Adsorption Processes During Electrochemical Atomic Layer Deposition of Gold", J. Electrochem. Soc., 168 (2021) 112505. Download

• B. Kersten, K. Hawthorne, M. Williamson, R. Akolkar, and C. E. Duval, "The Future of Nuclear Energy: Electrochemical Reprocessing of Fuel Takes Center Stage", Electrochem. Soc. Interface, 30 (2021) 45. Download

• A. Maraschky and R. Akolkar, "Pulsed Current Plating Does Not Improve Microscale Current Distribution Uniformity Compared to Direct Current Plating at Equivalent Time-Averaged Plating Rates", J. Electrochem. Soc., 168 (2021) 062507. Download

• Y. Gong and R. Akolkar, "Thermodynamic Considerations in the Design of Electrochemical Atomic Layer Etching of Copper ", J. Electrochem. Soc., 168 (2021) 062503. Download

• Y. Gong, A. L. Clemens, J. T. Davis, C. A. Orne, N. A. Dudukovic, A. N. Ivanovskaya and R. Akolkar, "Methods - Design Guidelines for Tubular Flow-through Electrodes for Use in Electroanalytical Studies of Redox Reaction Kinetics", J. Electrochem. Soc., 168 (2021) 043505. Download

2020

• N. A. Shaheen, I. Mahesh, M. B. Vukmirovic and R. Akolkar, "Mechanism of Electrochemical Oxidation of Nitroxide Radicals in Ethaline Deep Eutectic Solvent", J. Electrochem. Soc., 167 (2020) 143505. Download

• N. A. Shaheen, I. Mahesh, M. B. Vukmirovic and R. Akolkar, "Hysteresis effects and roughness suppression efficacy of polyethylenimine additive in Cu electrodeposition in ethaline", Electrochemistry Communications, 115 (2020) 106721. Download

• Y. Gong and R. Akolkar, "Electrochemical Atomic Layer Etching of Ruthenium", J. Electrochem. Soc., 167 (2020) 062510. Download

• A. Maraschky and R. Akolkar, "Temperature Dependence of Dendritic Lithium Electrodeposition: A Mechanistic Study of Transport Limitations within the SEI", J. Electrochem. Soc., 167 (2020) 062503. Download

• X. Shen, N. Sinclair, J. Wainright, R. Akolkar, and R. F. Savinell, "Evaluating and Developing a Reliable Reference Electrode for Choline Chloride Based Deep Eutectic Solvents", J. Electrochem. Soc., 167 (2020) 086509. Download

• M. B. Vukmirovic, R. R. Adzic, and R. Akolkar, "Copper Electrodeposition from Deep Eutectic Solvents - Voltammetric Studies Providing Insight into the Role of Substrate: Platinum vs. Glassy Carbon", J. Phys. Chem. B, (2020). Download

2019

• D. Shen, M. B. Vukmirovic and R. Akolkar, "Understanding the Role of Complexation in the Charge-Transfer Kinetics of the Cu²⁺ + e ↔ Cu¹⁺ Redox Reaction in Ethaline Deep Eutectic Solvent" J. Electrochem. Soc., 166 (15), E526 - E532 (2019). Download

• A. Joi, K. Venkatraman, K.C. Tso, D. Dictus, Y. Dordi, P.W. Wu, C.W. Pao and R. Akolkar, "Interface Engineering Strategy Utilizing Electrochemical ALD of Cu-Zn for Enabling Metallization of Sub-10 nm Semiconductor Device Nodes", ECS J. Solid State Sci. Technol., 8 (9), P516 (2019). Download

• X. Liu, O. Bolton and R. Akolkar, "Experimental and Modeling Studies of the Hysteresis Behavior and Dendrite Suppression Efficacy of an Electrolyte Additive in Zinc Electrodeposition", J. Electrochem. Soc., 166 (13), D583 (2019). Download

• T. Liu, X. Liu, S. Bhattacharya, Z. Ye, R. He, X.P.A. Gao, R. Akolkar, and R.M. Sankaran, "Plasma-Induced Fabrication and Straining of MoS2 Films for the Hydrogen Evolution Reaction", ACS Appl. Energy Mater., 2, 7, 5162 (2019). Download

• X. Zhan, M. Daniil, X. Liu, M. Willard, R. Akolkar, F. Ernst, "Effect of Tungsten Alloying on Magnetic Properties of Amorphous Ni-P", J. Alloy Compd., 786, 742 (2019). Download

• K. Venkatraman, R. Gusley A. Lesak and R. Akolkar, "Electrochemistry-Enabled Atomic Layer Deposition of Copper: Investigation of the Deposit Growth Rate and Roughness", J. Vac Sci. Technol. A, 37, 020901 (2019). Download

2018

• D. Shen, K. Steinberg and R. Akolkar, "Avoiding Pitfalls in the Determination of Reliable Electrochemical Kinetics Parameters for the Cu²⁺ → Cu¹⁺ Reduction Reaction in Deep Eutectic Solvents", J. Electrochem. Soc., 165 (14), E808-E815 (2018). Download

• A. Maraschky and R. Akolkar, "Mechanism Explaining the Onset Time of Dendritic Lithium Electrodeposition via Considerations of the Li⁺ Transport within the Solid Electrolyte Interphase", J. Electrochem. Soc., 165 (14), D696-D703 (2018). Download

• Y. Gong, K. Venkatraman and R. Akolkar, "Communication--Electrochemical Atomic Layer Etching of Copper", J. Electrochem. Soc., 165(7), D282 (2018). Download

• K. Venkatraman, A. Joi, Y. Dordi and R. Akolkar, "Electroless Atomic Layer Deposition of Copper", Electrochem. Comm., 91, 45 (2018). Download

• X. Liu, K. Venkatraman, and R. Akolkar, "Communication—Electrochemical Sensor Concept for the Detection of Lead Contamination in Water Utilizing Lead Underpotential Deposition", J. Electrochem. Soc., 165(2), B9-B11 (2018). Download

• R. Akolkar, "Current Status and Advances in Damascene Electrodeposition", Reference Module in Chemistry, Molecular Sciences and Chemical Engineering, Elsevier, 2017, ISBN: 9780124095472. Download

2017

• S. Ghosh, R. Hawtof, P. Rumbach, D. B. Go, R. Akolkar, and R. M. Sankaran, "Quantitative Study of Electrochemical Reduction of Ag⁺ to Ag Nanoparticles in Aqueous Solutions by a Plasma Cathode", J. Electrochem. Soc., 164(13), D818-D824 (2017). Download

• D. Shen and R. Akolkar, "Electrodeposition of Neodymium from NdCl₃-Containing Eutectic LiCl–KCl Melts Investigated Using Voltammetry and Diffusion-Reaction Modeling", J. Electrochem. Soc., 164 (8), H5292-H5298 (2017). Download

• X. Liu, W. Richtering and R. Akolkar, "Investigation of the Kinetics and Mass Transport Aspects of Hydrogen Evolution during Electroless Deposition of Nickel-Phosphorus", J. Electrochem. Soc., 164 (7), D498-D504 (2017). Download

• L. Yu and R. Akolkar, "Lead underpotential deposition for the surface characterization of silver ad-atom modified gold electrocatalysts for glucose oxidation", J. Electroanal. Chem., 792, 61-65 (2017). Download

• K. Venkatraman, Y. Dordi and R. Akolkar, "Electrochemical Atomic Layer Deposition of Cobalt Enabled by the Surfaced-Limited Redox Replacement of Underpotentially Deposited Zinc", J. Electrochem. Soc., 164 (2), D104-D109 (2017). Download

• X. Zhan, P. Zhang, P.M. Voyles, X. Liu, R. Akolkar, and F. Ernst, "Effect of tungsten alloying on short-to-medium-range-order evolution and crystallization behavior of near-eutectic amorphous Ni-P", Acta Mater., 122, 400-411 (2017). Download

2016

• M. Zhao, L. Yu, R. Akolkar, and A.B. Anderson, "Mechanism of Electroless Copper Deposition from [Cu^IIEDTA]^2- Complexes Using Aldehyde-Based Reductants", J. Phys. Chem. C, 120(43), 24789-24793 (2016). Download

• K. Kumar Rao, M. Ferguson, K. Murphy, J. Zhao, D. Lacks and R. Akolkar, "Electrochemical Characterization of Micro-cracks in Polyurethane Resin Films Deposited on Metallic Surfaces", J. Appl. Electochem. (2016). doi:10.1007/s10800-016-1005-6 Download

• S. Banik, K. Kumar Rao and R. Akolkar, "Determination of the Diffusion-Adsorption Properties of Polymeric Electrolyte Additives Using an Additive Injection Method Implemented on a Rotating Disc Electrode", J. Electrochem. Soc., 163 (9), E241-E247 (2016). Download

• L. Yu, Z. Vashaei, F. Ernst and R. Akolkar, "Electroless Deposition of Copper-Manganese for Applications in Semiconductor Interconnect Metallization", J. Electrochem. Soc., 163 (8), D374-D378 (2016). Download

• K. Venkatraman, R. Gusley, L. Yu, Y. Dordi and R. Akolkar, "Electrochemical Atomic Layer Deposition of Copper: A Lead-Free Process Mediated by Surfaced-Limited Redox Replacement of Underpotentially Deposited Zinc", J. Electrochem. Soc., 163 (12), D3008-D3013 (2016). Download

• L. Yu and R. Akolkar, "Communication-Underpotential Deposition of Lead for Investigating the Early Stages of Electroless Copper Deposition on Ruthenium", J. Electrochem. Soc., 163 (06), D247-D249 (2016). Download

2015

• A. Miller, L. Yu, J. Blickensderfer and R. Akolkar, "Electrochemical Copper Metallization of Glass Substrates Mediated by Solution-Phase Deposition of Adhesion-Promoting Layers", J. Electrochem. Soc., 162 (14), D630-D634 (2015). Download

• S. Banik and R. Akolkar, “Suppressing Dendritic Growth during Alkaline Zn Electrodeposition using Polyethylenimine Additive”, Electrochim. Acta, 179, 475-481 (2015). Download

• S. Ghosh, B. Bishop, I. Morrison, R. Akolkar, D. Scherson and R. Mohan Sankaran, “Generation of a direct-current, atmospheric-pressure microplasma at the surface of a liquid water microjet for continuous plasma-liquid processing”, J. Vac. Sci. Technol. A, 33, 021312 (2015). Download

2014

• J. Blickensderfer, P. Altemare, K. Thiel, H. Schreier, and R. Akolkar, “Direct Electroless Plating of Iron-Boron on Copper”, J. Electrochem. Soc., 161 (10), D495-D498 (2014). Download

• R. Akolkar, “Modeling dendrite growth during lithium electrodeposition at sub-ambient temperature”, J. Power Sources, 246, 84-89 (2014). Download

• C. Kung, P. Lin, Y. Xue, R. Akolkar, L. Dai, X. Yu, and C. Liu, “3D graphene foam supported Pt–Ru bimetallic nanocatalysts for direct methanol and direct ethanol fuel cell applications”, J. Power Sources, 256, 329-335 (2014). Download

2013

• S. Banik and R. Akolkar, “Suppressing Dendrite Growth during Zn electrodeposition by PEG-200 additive”, J. Electrochem. Soc., 160 (11) D519-D523 (2013). Download

• R. Akolkar, and R. M. Sankaran, “Charge transfer processes at the interface between plasmas and liquids”, J. Vac. Sci. Technol. A, 31, 050811 (2013). Download

• A. Joi, R. Akolkar and U. Landau, “Pulse Electrodeposition of Copper-Manganese Alloy for Application in Interconnect Metallization”, J. Electrochem. Soc. 160 (12), D3145-D3148 (2013). Download

• R. Akolkar, “Characterizing Transport Limitations during Copper Electrodeposition of High Aspect Ratio Through-Silicon Vias”, ECS Electrochem. Lett. 2 (2), D5-D8 (2013). Download

• R. Akolkar, “Mathematical model of the dendritic growth during lithium electrodeposition”, J. Power Sources, 232, 23-28 (2013). Download

• A. Joi, R. Akolkar and U. Landau, “Additives for Bottom-up Copper Plating from an Alkaline Complexed Electrolyte”, J. Electrochem. Soc. 160 (12), D3001-D3003 (2013). Download

• L. Yu, L. Guo, R. Preisser, and R. Akolkar, “Autocatalysis during Electroless Copper Deposition using Glyoxylic Acid as Reducing Agent”, J. Electrochem. Soc. 160 (12), D3004-D3008 (2013). Download

• A. Joi, R. Akolkar, and U. Landau, “Pulse Plating of Copper Germanide”, Applied Physics Letters, 102, 134107 (2013). Download

2012

• R. Akolkar, “Analytical Model for the Current Distribution during Copper Electrodeposition on Resistive Wafers under Tafel Kinetics”, ECS Electrochem. Lett. 1 (6), D29-D32 (2012). Download

2010 and beyond

• R. Akolkar and U. Landau, “Mechanistic Analysis of Bottom-up Fill in Copper Interconnect Metallization”, J. Electrochem. Soc., 156 (9), D351-D359 (2009). Download

• J. Mendez, R. Akolkar, and U. Landau “Novel Polyether Suppressors Enabling Copper Metallization of High Aspect Ratio Interconnects”, J. Electrochem. Soc., 156 (11) D474-D479 (2009). Download

• J. Mendez, R. Akolkar, T. Andryushchenko, and U. Landau, “A Mechanistic Model for Copper Electropolishing in Phosphoric Acid”, J. Electrochem. Soc. 155 (1), D27-D34 (2008). Download

• R. Akolkar and V. Dubin, “Analysis of the Suppressor Concentration Field Effect during Damascene Copper Electrodeposition”, Electrochem. Solid-State Lett., 10, D55-D59 (2007). Download

• V. Dubin, R. Akolkar, C. Cheng, R. Chebiam, A. Fajardo, and F. Gstrein, review paper entitled “Electrochemical Materials and Processes in Silicon Nanotechnology”, Electrochimica Acta 52 (8), 2891-2897 (2007). Download

• R. Akolkar, H. Kuo and Yar-Ming Wang, “Kinetics of the Electrolytic Coloring Process on Anodized Aluminum”, J. Appl. Electrochem., 37 (2), 291-296 (2006). Download

• R. Akolkar and U. Landau, “A Time-Dependent Transport-Kinetics Model for Additives Interactions in Copper Interconnect Metallization”, J. Electrochem. Soc., 151 (11), C702-C711 (2004). Download

• R. Akolkar, U. Landau, H. Kuo and Yar-Ming Wang, “Modeling of the Current Distribution in Aluminum Anodization”, J. Appl. Electrochem., 34 (8), 807-813 (2004). Download

* Underline indicates student author