* Underline indicates student author


  • A. Joi, K. Venkatraman, K.C. Tso, D. Dictus, Y. Dordi, P.W. Wu, C.W. Pao and R. Akolkar, "Interface Engineering Strategy Utilizing Electrochemical ALD of Cu-Zn for Enabling Metallization of Sub-10 nm Semiconductor Device Nodes", ECS J. Solid State Sci. Technol., 8 (9), P516 (2019). Download

  • X. Liu, O. Bolton and R. Akolkar, "Experimental and Modeling Studies of the Hysteresis Behavior and Dendrite Suppression Efficacy of an Electrolyte Additive in Zinc Electrodeposition", J. Electrochem. Soc., 166 (13), D583 (2019). Download

  • T. Liu, X. Liu, S. Bhattacharya, Z. Ye, R. He, X.P.A. Gao, R. Akolkar, and R.M. Sankaran, "Plasma-Induced Fabrication and Straining of MoS2 Films for the Hydrogen Evolution Reaction", ACS Appl. Energy Mater., 2, 7, 5162 (2019). Download

  • X. Zhan, M. Daniil, X. Liu, M. Willard, R. Akolkar, F. Ernst, "Effect of Tungsten Alloying on Magnetic Properties of Amorphous Ni-P", J. Alloy Compd., 786, 742 (2019). Download

  • K. Venkatraman, R. Gusley A. Lesak and R. Akolkar, "Electrochemistry-Enabled Atomic Layer Deposition of Copper: Investigation of the Deposit Growth Rate and Roughness", J. Vac Sci. Technol. A, 37, 020901 (2019). Download


  • D. Shen, K. Steinberg and R. Akolkar, "Avoiding Pitfalls in the Determination of Reliable Electrochemical Kinetics Parameters for the Cu2+ → Cu1+ Reduction Reaction in Deep Eutectic Solvents", J. Electrochem. Soc., 165 (14), E808-E815 (2018). Download

  • A. Maraschky and R. Akolkar, "Mechanism Explaining the Onset Time of Dendritic Lithium Electrodeposition via Considerations of the Li+ Transport within the Solid Electrolyte Interphase", J. Electrochem. Soc., 165 (14), D696-D703 (2018). Download

  • Y. GongK. Venkatraman and R. Akolkar, "Communication--Electrochemical Atomic Layer Etching of Copper", J. Electrochem. Soc., 165(7), D282 (2018). Download

  • K. Venkatraman, A. Joi, Y. Dordi and R. Akolkar, "Electroless Atomic Layer Deposition of Copper", Electrochem. Comm., 91, 45 (2018). Download

  • X. LiuK. Venkatraman, and R. Akolkar, "Communication—Electrochemical Sensor Concept for the Detection of Lead Contamination in Water Utilizing Lead Underpotential Deposition", J. Electrochem. Soc., 165(2), B9-B11 (2018). Download

  • R. Akolkar, "Current Status and Advances in Damascene Electrodeposition", Reference Module in Chemistry, Molecular Sciences and Chemical Engineering, Elsevier, 2017, ISBN: 9780124095472. Download


  • S. Ghosh, R. Hawtof, P. Rumbach, D. B. Go, R. Akolkar, and R. M. Sankaran, "Quantitative Study of Electrochemical Reduction of Ag+ to Ag Nanoparticles in Aqueous Solutions by a Plasma Cathode", J. Electrochem. Soc., 164(13), D818-D824 (2017). Download

  • D. Shen and R. Akolkar, "Electrodeposition of Neodymium from NdCl3-Containing Eutectic LiCl–KCl Melts Investigated Using Voltammetry and Diffusion-Reaction Modeling", J. Electrochem. Soc., 164 (8), H5292-H5298 (2017). Download

  • X. Liu, W. Richtering and R. Akolkar, "Investigation of the Kinetics and Mass Transport Aspects of Hydrogen Evolution during Electroless Deposition of Nickel-Phosphorus", J. Electrochem. Soc., 164 (7), D498-D504 (2017). Download

  • L. Yu and R. Akolkar, "Lead underpotential deposition for the surface characterization of silver ad-atom modified gold electrocatalysts for glucose oxidation", J. Electroanal. Chem., 792, 61-65 (2017). Download

  • K. Venkatraman, Y. Dordi and R. Akolkar, "Electrochemical Atomic Layer Deposition of Cobalt Enabled by the Surfaced-Limited Redox Replacement of Underpotentially Deposited Zinc", J. Electrochem. Soc., 164 (2), D104-D109 (2017). Download

  • X. Zhan, P. Zhang, P.M. Voyles, X. Liu, R. Akolkar, and F. Ernst, "Effect of tungsten alloying on short-to-medium-range-order evolution and crystallization behavior of near-eutectic amorphous Ni-P", Acta Mater., 122, 400-411 (2017). Download


  • M. Zhao, L. Yu, R. Akolkar, and A.B. Anderson, "Mechanism of Electroless Copper Deposition from [CuIIEDTA]2- Complexes Using Aldehyde-Based Reductants", J. Phys. Chem. C, 120(43), 24789-24793 (2016). Download

  • K. Kumar Rao, M. Ferguson, K. Murphy, J. Zhao, D. Lacks and R. Akolkar, "Electrochemical Characterization of Micro-cracks in Polyurethane Resin Films Deposited on Metallic Surfaces", J. Appl. Electochem. (2016). doi:10.1007/s10800-016-1005-6 Download

  • S. Banik, K. Kumar Rao and R. Akolkar, "Determination of the Diffusion-Adsorption Properties of Polymeric Electrolyte Additives Using an Additive Injection Method Implemented on a Rotating Disc Electrode", J. Electrochem. Soc., 163 (9), E241-E247 (2016). Download

  • L. Yu, Z. Vashaei, F. Ernst and R. Akolkar, "Electroless Deposition of Copper-Manganese for Applications in Semiconductor Interconnect Metallization", J. Electrochem. Soc., 163 (8), D374-D378 (2016). Download

  • K. Venkatraman, R. Gusley, L. Yu, Y. Dordi and R. Akolkar, "Electrochemical Atomic Layer Deposition of Copper: A Lead-Free Process Mediated by Surfaced-Limited Redox Replacement of Underpotentially Deposited Zinc", J. Electrochem. Soc., 163 (12), D3008-D3013 (2016). Download

  • L. Yu and R. Akolkar, "Communication-Underpotential Deposition of Lead for Investigating the Early Stages of Electroless Copper Deposition on Ruthenium", J. Electrochem. Soc., 163 (06), D247-D249 (2016). Download


  • A. Miller, L. Yu, J. Blickensderfer and R. Akolkar, "Electrochemical Copper Metallization of Glass Substrates Mediated by Solution-Phase Deposition of Adhesion-Promoting Layers", J. Electrochem. Soc., 162 (14), D630-D634 (2015). Download

  • S. Banik and R. Akolkar, “Suppressing Dendritic Growth during Alkaline Zn Electrodeposition using Polyethylenimine Additive”, Electrochim. Acta, 179, 475-481 (2015). Download

  • S. Ghosh, B. Bishop, I. Morrison, R. Akolkar, D. Scherson and R. Mohan Sankaran, “Generation of a direct-current, atmospheric-pressure microplasma at the surface of a liquid water microjet for continuous plasma-liquid processing, J. Vac. Sci. Technol. A, 33, 021312 (2015). Download


  • J. Blickensderfer, P. Altemare, K. Thiel, H. Schreier, and R. Akolkar, “Direct Electroless Plating of Iron-Boron on Copper”, J. Electrochem. Soc., 161 (10), D495-D498 (2014). Download

  • R. Akolkar, “Modeling dendrite growth during lithium electrodeposition at sub-ambient temperature”, J. Power Sources, 246, 84-89 (2014). Download

  • C. Kung, P. Lin, Y. Xue, R. Akolkar, L. Dai, X. Yu, and C. Liu, “3D graphene foam supported Pt–Ru bimetallic nanocatalysts for direct methanol and direct ethanol fuel cell applications”, J. Power Sources, 256, 329-335 (2014). Download


  • S. Banik and R. Akolkar, “Suppressing Dendrite Growth during Zn electrodeposition by PEG-200 additive”, J. Electrochem. Soc., 160 (11) D519-D523 (2013). Download

  • R. Akolkar, and R. M. Sankaran, “Charge transfer processes at the interface between plasmas and liquids”, J. Vac. Sci. Technol. A, 31, 050811 (2013). Download

  • A. Joi, R. Akolkar and U. Landau, “Pulse Electrodeposition of Copper-Manganese Alloy for Application in Interconnect Metallization”, J. Electrochem. Soc. 160 (12), D3145-D3148 (2013). Download

  • R. Akolkar, “Characterizing Transport Limitations during Copper Electrodeposition of High Aspect Ratio Through-Silicon Vias”, ECS Electrochem. Lett. 2 (2), D5-D8 (2013). Download

  • R. Akolkar, “Mathematical model of the dendritic growth during lithium electrodeposition”, J. Power Sources, 232, 23-28 (2013). Download

  • A. Joi, R. Akolkar and U. Landau, “Additives for Bottom-up Copper Plating from an Alkaline Complexed Electrolyte”, J. Electrochem. Soc. 160 (12), D3001-D3003 (2013). Download

  • L. Yu, L. Guo, R. Preisser, and R. Akolkar, “Autocatalysis during Electroless Copper Deposition using Glyoxylic Acid as Reducing Agent”, J. Electrochem. Soc. 160 (12), D3004-D3008 (2013). Download

  • A. Joi, R. Akolkar, and U. Landau, “Pulse Plating of Copper Germanide”, Applied Physics Letters, 102, 134107 (2013). Download


  • R. Akolkar, “Analytical Model for the Current Distribution during Copper Electrodeposition on Resistive Wafers under Tafel Kinetics”, ECS Electrochem. Lett. 1 (6), D29-D32 (2012). Download

2010 and beyond

  • R. Akolkar and U. Landau, “Mechanistic Analysis of Bottom-up Fill in Copper Interconnect Metallization”, J. Electrochem. Soc., 156 (9), D351-D359 (2009). Download

  • J. Mendez, R. Akolkar, and U. Landau “Novel Polyether Suppressors Enabling Copper Metallization of High Aspect Ratio Interconnects”, J. Electrochem. Soc., 156 (11) D474-D479 (2009). Download

  • J. Mendez, R. Akolkar, T. Andryushchenko, and U. Landau, “A Mechanistic Model for Copper Electropolishing in Phosphoric Acid”, J. Electrochem. Soc. 155 (1), D27-D34 (2008). Download

  • R. Akolkar and V. Dubin, “Analysis of the Suppressor Concentration Field Effect during Damascene Copper Electrodeposition”, Electrochem. Solid-State Lett., 10, D55-D59 (2007). Download

  • V. Dubin, R. Akolkar, C. Cheng, R. Chebiam, A. Fajardo, and F. Gstrein, review paper entitled “Electrochemical Materials and Processes in Silicon Nanotechnology”, Electrochimica Acta 52 (8), 2891-2897 (2007). Download

  • R. Akolkar, H. Kuo and Yar-Ming Wang, “Kinetics of the Electrolytic Coloring Process on Anodized Aluminum”, J. Appl. Electrochem., 37 (2), 291-296 (2006). Download

  • R. Akolkar and U. Landau, “A Time-Dependent Transport-Kinetics Model for Additives Interactions in Copper Interconnect Metallization”, J. Electrochem. Soc., 151 (11), C702-C711 (2004). Download

  • R. Akolkar, U. Landau, H. Kuo and Yar-Ming Wang, “Modeling of the Current Distribution in Aluminum Anodization”, J. Appl. Electrochem., 34 (8), 807-813 (2004). Download