Education
Ph.D., Chemical Engineering, University of California, Berkeley, 1975
M.S., Chemical Engineering, Technion, Israel Inst. of Technology, 1968
B.S., Chemical Engineering, Technion, Israel Inst. of Technology, 1964
Research Interests
Electrochemical Engineering
Teaching Interests
Electrochemical Engineering, Transport
Patents Pending
2013, "Electrowinning Cell and Process," 13/947,342,
Uzi Landau.
Publications
Boehme, L., & Landau, U.
(2016).
Additives Co-Injection: A Test for Determining the Efficacy and Process Parameters of Bottom-up Plating.
Journal of The Electrochemical Society [00134651],
163
(7),
D314-D321.
Boehme, L., & Landau, U.
(2016).
Rapid screening of plating additives for bottom-up metallization of nano-scale features.
Journal of Applied Electrochemistry,
46
(1),
39-46.
Joi, A., Akolkar, R. N., & Landau, U.
(2013).
Pulse Electrodeposition of Copper-Manganese Alloy for Application in Interconnect Metallization.
Journal of Electrochemical Society,
160
(12),
D3145-D3148.
Adelung, R., Ernst, F., Zheng, N., & Landau, U.
(2004).
In-situ Nanoscale Observation and Control of Electron-Beam-Induced Cluster Formation.
Journal of Vacuum Science and Technology B,
22
(),
1797-1802.
