About the Electronics Design Center

Students in cleanroom working on spin coater








The Electronics Design Center (EDC) has been a cost and research center at Case Western Reserve University since 1960. The EDC has conducted research in various areas, including implant electronics, solid-state chemical and biomedical sensors, and micro-electrochemical systems such as fuel cells. The center also specializes in electrodeposition for nano-electronics, batteries, sensors, and electrometallurgy. The EDC is a core facility that provides users with device micro-fabrication services through thin film, thick film, lithography tools, and clean room facilities.

The EDC facilitates research by offering access, training, and guidance on fabrication processes and services. It caters to researchers from Case Western Reserve University and external organizations seeking R&D services. The EDC provides equipment for photolithography, thin film deposition (metals and dielectrics), thick film printing, and dicing. It is situated in the basement of the Bingham Building on the university's main quad and comprises three cleanrooms with additional characterization and cutting tools available nearby. View a full list of equipment and capabilities

For more information, please contact the center's director, Professor Rohan Akolkar of the Department of Chemical and Biomolecular Engineering. He was appointed as director on August 3, 2022. Akolkar, the Milton and Tamar Maltz Professor and Ohio Eminent Scholar, is a pioneering researcher in the field of electrochemistry and electrochemical engineering. The EDC will benefit from his extensive academic and industrial expertise in electrochemical nano-fabrication. His leadership will uphold EDC's tradition of impactful research and practical education for students.

For more information, please contact the center's director, Professor Rohan Akolkar or the center's chief engineer, Laurie Dudik. Both Akolkar and Dudik have extensive experience in thin film fabrication, device fabrication and wafer level micro-fabrication.