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Microchannel Cooling Strategies for High Heat Flux (1 kW/cm(2)) Power Electronic Applications

  • Read more about Microchannel Cooling Strategies for High Heat Flux (1 kW/cm(2)) Power Electronic Applications

Assessment of body force effects in flow condensation, part II: Criteria for negating influence of gravity

  • Read more about Assessment of body force effects in flow condensation, part II: Criteria for negating influence of gravity

Assessment of body force effects in flow condensation, Part I: Experimental investigation of liquid film behavior for different orientations

  • Read more about Assessment of body force effects in flow condensation, Part I: Experimental investigation of liquid film behavior for different orientations

Phase Separation Microfluidics for Heat Transfer Applications

  • Read more about Phase Separation Microfluidics for Heat Transfer Applications

Modular Heat Sink for Chip-Scale GaN Transistors in Multilevel Converters

  • Read more about Modular Heat Sink for Chip-Scale GaN Transistors in Multilevel Converters

Experimental Investigation of Embedded Micropin-Fins for Single-Phase Heat Transfer and Pressure Drop

  • Read more about Experimental Investigation of Embedded Micropin-Fins for Single-Phase Heat Transfer and Pressure Drop

Busbar Design for Distributed DC-Link Capacitor Banks for Traction Applications

  • Read more about Busbar Design for Distributed DC-Link Capacitor Banks for Traction Applications

Single-phase thermal and hydraulic performance of embedded silicon micro-pin fin heat sinks using R245fa

  • Read more about Single-phase thermal and hydraulic performance of embedded silicon micro-pin fin heat sinks using R245fa

A New Mechanistic Model for Predicting Flow Boiling Critical Heat Flux Based on Hydrodynamic Instabilities

  • Read more about A New Mechanistic Model for Predicting Flow Boiling Critical Heat Flux Based on Hydrodynamic Instabilities

Embedded cooling with 3D manifold for vehicle power electronics application: Single-phase thermal-fluid performance

  • Read more about Embedded cooling with 3D manifold for vehicle power electronics application: Single-phase thermal-fluid performance

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Case School of Engineering
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Nord Hall
2095 Martin Luther King Jr Dr
Rm 500
Cleveland, OH 44106

Mailing Address:
10900 Euclid Ave.
Cleveland, Ohio 44106-7148

Phone: 216.368.4436

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