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“Flow distribution and maximu current density studies in redox flow batteries with single passage of the serpentine flow channel”

  • Read more about “Flow distribution and maximu current density studies in redox flow batteries with single passage of the serpentine flow channel”

A Simple Analytical Model of Coupled Single Flow Channel over Porous Electrode in Vanadium Redox Flow Battery with Serpentine Flow Channel

  • Read more about A Simple Analytical Model of Coupled Single Flow Channel over Porous Electrode in Vanadium Redox Flow Battery with Serpentine Flow Channel

Analytical Model for the Current Distribution during Copper Electrodeposition on Resistive Wafers under Tafel Kinetics

  • Read more about Analytical Model for the Current Distribution during Copper Electrodeposition on Resistive Wafers under Tafel Kinetics

Characterizing Transport Limitations during Copper Electrodeposition of High Aspect Ratio Through-Silicon Vias

  • Read more about Characterizing Transport Limitations during Copper Electrodeposition of High Aspect Ratio Through-Silicon Vias

Mathematical model of the dendritic growth during lithium electrodeposition

  • Read more about Mathematical model of the dendritic growth during lithium electrodeposition

Additives for Bottom-up Copper Plating from an Alkaline Complexed Electrolyte

  • Read more about Additives for Bottom-up Copper Plating from an Alkaline Complexed Electrolyte

Charge transfer processes at the interface between plasmas and liquids

  • Read more about Charge transfer processes at the interface between plasmas and liquids

Suppressing Dendrite Growth during Zn electrodeposition by PEG-200 additive

  • Read more about Suppressing Dendrite Growth during Zn electrodeposition by PEG-200 additive

Pulse Plating of Copper Germanide

  • Read more about Pulse Plating of Copper Germanide

Pulse Electrodeposition of Copper-Manganese Alloy for Application in Interconnect Metallization

  • Read more about Pulse Electrodeposition of Copper-Manganese Alloy for Application in Interconnect Metallization

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Case School of Engineering
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Nord Hall
2095 Martin Luther King Jr Dr
Rm 500
Cleveland, OH 44106

Mailing Address:
10900 Euclid Ave.
Cleveland, Ohio 44106-7148

Phone: 216.368.4436

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