Electrochemical Atomic Layer Deposition of Copper: A Lead-Free Process Mediated by Surface-Limited Redox Replacement of Underpotentially Deposited Zinc | Case School of Engineering

Friday, January 1, 2016 - 12:00 PM

Kailash Venkatraman

2016

Journal of The Electrochemical Society [00134651]

163

12

D3008-D3013

School - Advanced Materials