Yu, L., & Akolkar, R. N.(2017).Lead underpotential deposition for the surface characterization of silver ad-atom modified gold electrocatalysts for glucose oxidation.Journal of Electroanalytical Chemistry,792, 61-65.
Zhao, M., Yu, L., Akolkar, R. N., & Anderson, A. N.(2016).Mechanism of Electroless Copper Deposition from [Cu II EDTA] 2– Complexes Using Aldehyde-Based Reductants.Journal of Physical Chemistry C [19327447],120(43),24789-24793.
Venkatraman, K., Gusley, R., Yu, L., Dordi, Y., & Akolkar, R. N.(2016).Electrochemical Atomic Layer Deposition of Copper: A Lead-Free Process Mediated by Surface-Limited Redox Replacement of Underpotentially Deposited Zinc.Journal of The Electrochemical Society [00134651],163(12),D3008-D3013.
Miller, A., Yu, L., Blickensderfer, J., & Akolkar, R. N.(2015).Electrochemical Copper Metallization of Glass Substrates Mediated by Solution-Phase Deposition of Adhesion-Promoting Layers.Journal of Electrochemical Society,162(14),D630-D634.
Yu, L., Vashaei, Z., Ernst, F., & Akolkar, R. N.(2015).Electroless Copper Deposition on Ruthenium: Effect of Additive on Growth, Coalescence and Roughness EvolutionElectroless Copper Deposition on Ruthenium: Effect of Additive on Growth, Coalescence and Roughness Evolution.Journal of the Electrochemical Society,163, D374-D378.
Yu, L., Guo, L., Preisser, R., & Akolkar, R. N.(2013).Autocatalysis during Electroless Copper Deposition using Glyoxylic Acid as Reducing Agent.Journal of Electrochemical Society,160(12),D3004-D3008.
