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Joi, A., Venkatraman, K., Tso, K., Dictus, D., Dordi, Y., Wu, P., Pao, C., & Akolkar, R. N.(2019).Editors' Choice�Interface Engineering Strategy Utilizing Electrochemical ALD of Cu-Zn for Enabling Metallization of Sub-10 nm Semiconductor Device Nodes.ECS Journal of Solid State Science and Technology,8(9),P516-P521.
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Joi, A., Akolkar, R. N., & Landau, U. N.(2013).Pulse Plating of Copper Germanide.Applied Physics Letters,102, 134107.
Joi, A., Akolkar, R. N., & Landau, U. N.(2013).Pulse Electrodeposition of Copper-Manganese Alloy for Application in Interconnect Metallization.Journal of Electrochemical Society,160(12),D3145-D3148.
