All EECS News

IEEE Spectrum Features EECS Researchers’ Paper at IEDM 2013 – “Silicon Carbide Nanomechanical Switches Built to Last”

A silicon carbide nanomechanical switchThe end of Moore’s Law feels closer than ever. Chip-industry leaders are going to strange lengths—fin-shaped transistors and exotic semiconductors—to keep delivering better integrated circuits every year, and some alternatives are starting to look attractive. A number of research teams are working on substituting the transistor switches that form an IC’s logic and memory circuits with nanoscale electromechanical switches, or NEMS. One obstacle to real-world implementation has been that these devices wear out quickly and then break, but new findings presented at the International Electron Devices Meeting in Washington, D.C., yesterday show that these switches can actually function for days or weeks in air, putting them closer to a commercially viable life span.

EECS Faculty Member Philip Feng Selected to Participate in NAE’s U.S. Frontiers of Engineering Symposium

Philip FengPhilip Feng, assistant professor of EECS, is among the 81 invited participants to take part in the National Academy of Engineering’s (NAE) 19th Annual U.S. Frontiers of Engineering symposium. 

According to the Press Release of NAE, 81 of the nation's brightest young engineers have been selected to take part in the NAE’s 19th annual U.S. Frontiers of Engineering symposium.  Engineers ages 30 to 45 who are performing exceptional engineering research and technical work in a variety of disciplines will come together for the 2-1/2 day event.  The participants – from industry, academia, and government – were nominated by fellow engineers or organizations and chosen from 310 applicants. 

EECS Ph.D. Student Received Best Student Paper Award at IEEE NEMS 2013

Tina He

Tina He, a Ph.D. student in the Department of Electrical Engineering & Computer Science (EECS), mentored by Prof. Philip Feng, has won the Best Student Paper competition at the 8th IEEE International Conference on Nano/Micro Engineered & Molecular Systems (IEEE NEMS 2013), for presenting her paper entitled “Dual-Gate Silicon Carbide Nanoelectromechanical Switches”. 

EECS Faculty Research Achievements Recognized at IEEE SENSORS 2012 Conference

Wen Ko

At the IEEE SENSORS 2012 Conference recently held in Taipei, Taiwan, it was announced that Prof. Wen H. Ko has been chosen to receive the IEEE Sensors Council’s 2012 Technical Achievement Award

This distinguished honor has been given to Prof. Ko “for five decades of contributions to the international sensors community, featuring research achievements in microelectronics, implantable biomedical sensors, telemetry, biomedical instruments, microelectromechanical systems, and micropackaging technology”.  The award includes an honorarium. 

Prof. Ko currently leads a team consisting of Co-PIs, postdoctoral scholar, graduate and undergraduate students, focusing on advancing micropackaging and implantable microsystems research. 

In addition to Prof. Ko’s Technical Achievement Award, other Case EECS researchers have also received recognitions at the IEEE SENSORS 2012 Conference.  Prof. Chris Zorman was an Invited Speaker; he delivered an Invited Lecture on SiC MEMS Sensor Technologies.  Prof. Philip Feng was an Invited Tutorial Speaker, and he gave a Tutorial Lecture on Emerging Nanoelectromechanical Sensors (NEMS), for which he would also receive an honorarium. 

EECS Faculty and Collaborators Win $1.2 Million NSF Scalable NanoManufacturing (SNM) Grant for Developing Tools to Mass Produce Nanodevices on Flexible Substrates

Case Western Reserve University researchers have won a $1.2 million grant to develop technology for mass-producing flexible electronic devices at a whole new level of small.

As they’re devising new tools and techniques to make wires narrower than a particle of smoke, they’re also creating ways to build them in flexible materials and package the electronics in waterproofing layers of durable plastics.

The team of engineers, who specialize in different fields, ultimately aims to build flexible electronics that bend with the realities of life: Health-monitoring sensors that can be worn on or under the skin and foldable electronic devices as thin as a sheet of plastic wrap. And, further down the road, implantable nerve-stimulating electrodes that enable patients to regain control from paralysis or master a prosthetic limb.