2014,"Electroless Plating of Iron-Boron and Iron-Phosphorus",Jacob Blickensderfer, Paige Altemare, Kay-Oliver Thiel, & Hans-Juergen Schrier.
Publications
Miller, A., Yu, L., Blickensderfer, J., & Akolkar, R. N.(2015).Electrochemical Copper Metallization of Glass Substrates Mediated by Solution-Phase Deposition of Adhesion-Promoting Layers.Journal of Electrochemical Society,162(14),D630-D634.
