Profile Photo

Uzi Landau

Professor Emeritus, Chemical Engineering
Designs advanced electrochemical systems and processes
Office: 116a A.W. Smith
Phone Number: (216) 468-4132

Education

Ph.D., Chemical Engineering, University of California, Berkeley, 1975
M.S., Chemical Engineering, Technion, Israel Inst. of Technology, 1968
B.S., Chemical Engineering, Technion, Israel Inst. of Technology, 1964

Research Interests

Electrochemical Engineering

Teaching Interests

Electrochemical Engineering, Transport

Patents Pending

2013, "Electrowinning Cell and Process," 13/947,342, Uzi Landau.

Publications

Boehme, L., & Landau, U. (2016). Additives Co-Injection: A Test for Determining the Efficacy and Process Parameters of Bottom-up Plating. Journal of The Electrochemical Society [00134651], 163 (7), D314-D321.
Boehme, L., & Landau, U. (2016). Rapid screening of plating additives for bottom-up metallization of nano-scale features. Journal of Applied Electrochemistry, 46 (1), 39-46.
Joi, A., Akolkar, R. N., & Landau, U. (2013). Pulse Electrodeposition of Copper-Manganese Alloy for Application in Interconnect Metallization. Journal of Electrochemical Society, 160 (12), D3145-D3148.
Joi, A., Akolkar, R. N., & Landau, U. (2013). Pulse Plating of Copper Germanide. Applied Physics Letters, 102 (), 134107.
Adelung, R., Ernst, F., Zheng, N., & Landau, U. (2004). In-situ Nanoscale Observation and Control of Electron-Beam-Induced Cluster Formation. Journal of Vacuum Science and Technology B, 22 (), 1797-1802.