Joi, A., Venkatraman, K., Tso, K., Dictus, D., Dordi, Y., Wu, P., Pao, C., & Akolkar, R. N.(2019).Editors' Choice�Interface Engineering Strategy Utilizing Electrochemical ALD of Cu-Zn for Enabling Metallization of Sub-10 nm Semiconductor Device Nodes.ECS Journal of Solid State Science and Technology,8(9),P516-P521.
Joi, A., Venkatraman, K., Watson, S., Dries, D., Dordi, Y., Wu, P., Paolini, R., & Akolkar, R. N.(2019).Interface Engineering Strategy Utilizing Electrochemical ALD of Cu-Zn for Enabling Metallization of Sub-10 nm Semiconductor Device Nodes.ECS J. Solid State Sci. Technol., 8 (9), P516-.
