Jung, K., Cho, E., Lee, H., Kharangate, C., Zhou, F., Asheghi, M., Dede, E., & Goodson, K.(2020).Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-3D Manifold Coolers (EMMCs): Part 1-Experimental Study of Single-Phase Cooling Performance With R-245fa.JOURNAL OF ELECTRONIC PACKAGING,142(3).
Jung, K., Kharangate, C., Lee, H., Palko, J., Zhou, F., Asheghi, M., Dede, E., & Goodson, K.(2019).Embedded cooling with 3D manifold for vehicle power electronics application: Single-phase thermal-fluid performance.INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER,130, 1108-1119.
Jung, K., Kharangate, C., Lee, H., Palko, J., Zhou, F., Asheghi, M., Dede, E., & Goodson, K.(2019).Embedded cooling with 3D manifold for vehicle power electronics application: Single-phase thermal-fluid performance.INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER,130, 1108-1119.
