Publications

* Underline indicates student author

2019

  • X. Zhan, M. Daniil, X. Liu, M. Willard, R. Akolkar, F. Ernst, "Effect of Tungsten Alloying on Magnetic Properties of Amorphous Ni-P", J. Alloy Compd., 786, 742 (2019). Download

  • K. Venkatraman, R. Gusley A. Lesak and R. Akolkar, "Electrochemistry-Enabled Atomic Layer Deposition of Copper: Investigation of the Deposit Growth Rate and Roughness", J. Vac Sci. Technol. A, 37, 020901 (2019). Download

2018

  • D. Shen, K. Steinberg and R. Akolkar, "Avoiding Pitfalls in the Determination of Reliable Electrochemical Kinetics Parameters for the Cu2+ → Cu1+ Reduction Reaction in Deep Eutectic Solvents", J. Electrochem. Soc., 165 (14), E808-E815 (2018). Download

  • A. Maraschky and R. Akolkar, "Mechanism Explaining the Onset Time of Dendritic Lithium Electrodeposition via Considerations of the Li+ Transport within the Solid Electrolyte Interphase", J. Electrochem. Soc., 165 (14), D696-D703 (2018). Download

  • Y. GongK. Venkatraman and R. Akolkar, "Communication--Electrochemical Atomic Layer Etching of Copper", J. Electrochem. Soc., 165(7), D282 (2018). Download

  • K. Venkatraman, A. Joi, Y. Dordi and R. Akolkar, "Electroless Atomic Layer Deposition of Copper", Electrochem. Comm., 91, 45 (2018). Download

  • X. LiuK. Venkatraman, and R. Akolkar, "Communication—Electrochemical Sensor Concept for the Detection of Lead Contamination in Water Utilizing Lead Underpotential Deposition", J. Electrochem. Soc., 165(2), B9-B11 (2018). Download

  • R. Akolkar, "Current Status and Advances in Damascene Electrodeposition", Reference Module in Chemistry, Molecular Sciences and Chemical Engineering, Elsevier, 2017, ISBN: 9780124095472. Download

2017

  • S. Ghosh, R. Hawtof, P. Rumbach, D. B. Go, R. Akolkar, and R. M. Sankaran, "Quantitative Study of Electrochemical Reduction of Ag+ to Ag Nanoparticles in Aqueous Solutions by a Plasma Cathode", J. Electrochem. Soc., 164(13), D818-D824 (2017). Download

  • D. Shen and R. Akolkar, "Electrodeposition of Neodymium from NdCl3-Containing Eutectic LiCl–KCl Melts Investigated Using Voltammetry and Diffusion-Reaction Modeling", J. Electrochem. Soc., 164 (8), H5292-H5298 (2017). Download

  • X. Liu, W. Richtering and R. Akolkar, "Investigation of the Kinetics and Mass Transport Aspects of Hydrogen Evolution during Electroless Deposition of Nickel-Phosphorus", J. Electrochem. Soc., 164 (7), D498-D504 (2017). Download

  • L. Yu and R. Akolkar, "Lead underpotential deposition for the surface characterization of silver ad-atom modified gold electrocatalysts for glucose oxidation", J. Electroanal. Chem., 792, 61-65 (2017). Download

  • K. Venkatraman, Y. Dordi and R. Akolkar, "Electrochemical Atomic Layer Deposition of Cobalt Enabled by the Surfaced-Limited Redox Replacement of Underpotentially Deposited Zinc", J. Electrochem. Soc., 164 (2), D104-D109 (2017). Download

  • X. Zhan, P. Zhang, P.M. Voyles, X. Liu, R. Akolkar, and F. Ernst, "Effect of tungsten alloying on short-to-medium-range-order evolution and crystallization behavior of near-eutectic amorphous Ni-P", Acta Mater., 122, 400-411 (2017). Download

2016

  • M. Zhao, L. Yu, R. Akolkar, and A.B. Anderson, "Mechanism of Electroless Copper Deposition from [CuIIEDTA]2- Complexes Using Aldehyde-Based Reductants", J. Phys. Chem. C, 120(43), 24789-24793 (2016). Download

  • K. Kumar Rao, M. Ferguson, K. Murphy, J. Zhao, D. Lacks and R. Akolkar, "Electrochemical Characterization of Micro-cracks in Polyurethane Resin Films Deposited on Metallic Surfaces", J. Appl. Electochem. (2016). doi:10.1007/s10800-016-1005-6 Download

  • S. Banik, K. Kumar Rao and R. Akolkar, "Determination of the Diffusion-Adsorption Properties of Polymeric Electrolyte Additives Using an Additive Injection Method Implemented on a Rotating Disc Electrode", J. Electrochem. Soc., 163 (9), E241-E247 (2016). Download

  • L. Yu, Z. Vashaei, F. Ernst and R. Akolkar, "Electroless Deposition of Copper-Manganese for Applications in Semiconductor Interconnect Metallization", J. Electrochem. Soc., 163 (8), D374-D378 (2016). Download

  • K. Venkatraman, R. Gusley, L. Yu, Y. Dordi and R. Akolkar, "Electrochemical Atomic Layer Deposition of Copper: A Lead-Free Process Mediated by Surfaced-Limited Redox Replacement of Underpotentially Deposited Zinc", J. Electrochem. Soc., 163 (12), D3008-D3013 (2016). Download

  • L. Yu and R. Akolkar, "Communication-Underpotential Deposition of Lead for Investigating the Early Stages of Electroless Copper Deposition on Ruthenium", J. Electrochem. Soc., 163 (06), D247-D249 (2016). Download

2015

  • A. Miller, L. Yu, J. Blickensderfer and R. Akolkar, "Electrochemical Copper Metallization of Glass Substrates Mediated by Solution-Phase Deposition of Adhesion-Promoting Layers", J. Electrochem. Soc., 162 (14), D630-D634 (2015). Download

  • S. Banik and R. Akolkar, “Suppressing Dendritic Growth during Alkaline Zn Electrodeposition using Polyethylenimine Additive”, Electrochim. Acta, 179, 475-481 (2015). Download

  • S. Ghosh, B. Bishop, I. Morrison, R. Akolkar, D. Scherson and R. Mohan Sankaran, “Generation of a direct-current, atmospheric-pressure microplasma at the surface of a liquid water microjet for continuous plasma-liquid processing, J. Vac. Sci. Technol. A, 33, 021312 (2015). Download

2014

  • J. Blickensderfer, P. Altemare, K. Thiel, H. Schreier, and R. Akolkar, “Direct Electroless Plating of Iron-Boron on Copper”, J. Electrochem. Soc., 161 (10), D495-D498 (2014). Download

  • R. Akolkar, “Modeling dendrite growth during lithium electrodeposition at sub-ambient temperature”, J. Power Sources, 246, 84-89 (2014). Download

  • C. Kung, P. Lin, Y. Xue, R. Akolkar, L. Dai, X. Yu, and C. Liu, “3D graphene foam supported Pt–Ru bimetallic nanocatalysts for direct methanol and direct ethanol fuel cell applications”, J. Power Sources, 256, 329-335 (2014). Download

2013

  • S. Banik and R. Akolkar, “Suppressing Dendrite Growth during Zn electrodeposition by PEG-200 additive”, J. Electrochem. Soc., 160 (11) D519-D523 (2013). Download

  • R. Akolkar, and R. M. Sankaran, “Charge transfer processes at the interface between plasmas and liquids”, J. Vac. Sci. Technol. A, 31, 050811 (2013). Download

  • A. Joi, R. Akolkar and U. Landau, “Pulse Electrodeposition of Copper-Manganese Alloy for Application in Interconnect Metallization”, J. Electrochem. Soc. 160 (12), D3145-D3148 (2013). Download

  • R. Akolkar, “Characterizing Transport Limitations during Copper Electrodeposition of High Aspect Ratio Through-Silicon Vias”, ECS Electrochem. Lett. 2 (2), D5-D8 (2013). Download

  • R. Akolkar, “Mathematical model of the dendritic growth during lithium electrodeposition”, J. Power Sources, 232, 23-28 (2013). Download

  • A. Joi, R. Akolkar and U. Landau, “Additives for Bottom-up Copper Plating from an Alkaline Complexed Electrolyte”, J. Electrochem. Soc. 160 (12), D3001-D3003 (2013). Download

  • L. Yu, L. Guo, R. Preisser, and R. Akolkar, “Autocatalysis during Electroless Copper Deposition using Glyoxylic Acid as Reducing Agent”, J. Electrochem. Soc. 160 (12), D3004-D3008 (2013). Download

  • A. Joi, R. Akolkar, and U. Landau, “Pulse Plating of Copper Germanide”, Applied Physics Letters, 102, 134107 (2013). Download

2012

  • R. Akolkar, “Analytical Model for the Current Distribution during Copper Electrodeposition on Resistive Wafers under Tafel Kinetics”, ECS Electrochem. Lett. 1 (6), D29-D32 (2012). Download

2010 and beyond

  • R. Akolkar and U. Landau, “Mechanistic Analysis of Bottom-up Fill in Copper Interconnect Metallization”, J. Electrochem. Soc., 156 (9), D351-D359 (2009). Download

  • J. Mendez, R. Akolkar, and U. Landau “Novel Polyether Suppressors Enabling Copper Metallization of High Aspect Ratio Interconnects”, J. Electrochem. Soc., 156 (11) D474-D479 (2009). Download

  • J. Mendez, R. Akolkar, T. Andryushchenko, and U. Landau, “A Mechanistic Model for Copper Electropolishing in Phosphoric Acid”, J. Electrochem. Soc. 155 (1), D27-D34 (2008). Download

  • R. Akolkar and V. Dubin, “Analysis of the Suppressor Concentration Field Effect during Damascene Copper Electrodeposition”, Electrochem. Solid-State Lett., 10, D55-D59 (2007). Download

  • V. Dubin, R. Akolkar, C. Cheng, R. Chebiam, A. Fajardo, and F. Gstrein, review paper entitled “Electrochemical Materials and Processes in Silicon Nanotechnology”, Electrochimica Acta 52 (8), 2891-2897 (2007). Download

  • R. Akolkar, H. Kuo and Yar-Ming Wang, “Kinetics of the Electrolytic Coloring Process on Anodized Aluminum”, J. Appl. Electrochem., 37 (2), 291-296 (2006). Download

  • R. Akolkar and U. Landau, “A Time-Dependent Transport-Kinetics Model for Additives Interactions in Copper Interconnect Metallization”, J. Electrochem. Soc., 151 (11), C702-C711 (2004). Download

  • R. Akolkar, U. Landau, H. Kuo and Yar-Ming Wang, “Modeling of the Current Distribution in Aluminum Anodization”, J. Appl. Electrochem., 34 (8), 807-813 (2004). Download