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Students: competitors wanted for second annual DARPA thermal connector design challenge

Have a great design idea for a field-reversible thermal connector? The Defense Advanced Research Projects Agency (DARPA) and the Office of Naval Research are seeking undergraduate and graduate students to develop a novel design concept for their second annual Field-Reversible Thermal Connector (RevCon) Challenge. 

Students with qualifying designs have the opportunity to receive DARPA and Office of Naval Research support for buidling and testing their connector at the Johns Hopkins University Applied Physics Laboratory. Prizes are awarded for most creative, lowest resistance and easiest to implement designs.

Participants are asked to develop a novel, field-reversible, low-resistance, thermal connector that could improve upon the presently available “wedgelocks.” Such thermal connectors are ubiquitous and critical components in high power, military electronic modules, where they serve to transfer heat from the edge of a printed circuit board to the water-cooled or air-cooled wall of the electronic module.

Teams should complete their designs during the fall semester, with final demonstrations occuring in the spring.

Learn more about the RevCon design challenge.